July 6, 2021

Call for papers: HiPEAC track at embedded world

The next edition of embedded world, the premier international trade fair in embedded technologies, takes place in Nuremberg on 15-17 March 2022. In addition to the exhibition, embedded world includes a conference, and HiPEAC has teamed up for the organizers to create a HiPEAC track. A call for papers has been issued, with a deadline of 22 September 2021.

Submit your paper via the embedded world website, selecting the topic '11.4: High Performance Embedded Architectures'.

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TETRAMAX is a Horizon 2020 innovation action within the European Smart Anything Everywhere (SAE) initiative in the domain of customized and low-energy computing for Cyber Physical Systems and the Internet of Things. As a Digital Innovation Hub, TETRAMAX aims to bring added value to European industry, helping to gain competitive advantage through faster digitization. The project partially builds on experiences with the TETRACOM project during 2013-2016. TETRAMAX was launched in Sep 2017 and runs until Dec 2021.