Oct. 27, 2017

TETRAMAX presented at the SIITME conference in Romania

On 26-29 October 2017, IEEE organized its 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) in Constanta, Romania.

Our partner, Vladimir Stavrov from AMG presented TETRAMAX during the plenary sessions on Friday. More than 150 participants attended the conference this year!

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TETRAMAX is a Horizon 2020 innovation action within the European Smart Anything Everywhere (SAE) initiative in the domain of customized and low-energy computing for Cyber Physical Systems and the Internet of Things. As a Digital Innovation Hub, TETRAMAX aims to bring added value to European industry, helping to gain competitive advantage through faster digitization. The project partially builds on experiences with the TETRACOM project during 2013-2016. TETRAMAX was launched in Sep 2017 and runs until Dec 2021.