Offer #2019.36
Microsystems development for IoT, CPS, and more
microTEC Gesellschaft für Mikrotechnologie mbH
The problem/challenge
We offer Micropackaging and Assembly Technologies that are suitable for packaging of, e.g., photonic Chips, MOEMS, microfluidics. Applications are in the field of Internet of Things, Cyber physical Systems, or any Kind of miniaturised Systems.
The invention/product
We offer Micropackaging and Assembly Technologies that are suitable for packaging of, e.g., photonic Chips, MOEMS, microfluidics. Applications are in the field of Internet of Things, Cyber physical Systems, or any Kind of miniaturised Systems.
Companies/industry we are looking for
We are looking for companies performing microsystems development for IoT, CPS, and more.
Next steps/Activities
microTEC is interested in collaborations with partners for the development of microsystems.
Date published01/02/2019StatusLooking for collaborationTechnology areasAdditive Manufacturing (3D printing)Communication TechnologiesSensors, Actuators, MEMS and RFWireless Sensor Networks